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25 August 1997 Defect reduction in different periods of a fab's life
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Abstract
The reduction of yield loss caused by particles is a key topic of productivity enhancement. It deals with many components of a fab's structure: (1) Cultural mindset of managers, engineers, and operators -- to have champions for that mission, (2) selection of defect metrology tools -- with high throughput and reliable data, (3) single equipment characterization -- to set challenging specs according to the best performing tool, (4) inline reaction procedures -- to transfer knowledge and responsibility to the operators, (5) statistical evaluation of large datasets -- including correlation to electrical yield, (6) and to trace back the way to the single tools or the low performing processes. This paper discusses some topics to be considered during process and equipment planning, ramp up, and mature production. It has been proven to be successful during a very aggressive ramp up in wafer starts and an even more convincing yield increase of a fab, that now started the production of DRAM's in quarter micron technology. It will conclude in an understanding, that besides a reliable statistical methodology the human performance is the key: can we really integrate people of different groups and levels of responsibility and motivate them to take joint actions for yield goals?
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Norbert Kallis "Defect reduction in different periods of a fab's life", Proc. SPIE 3213, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing III, (25 August 1997); https://doi.org/10.1117/12.284622
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