Influence of processes and selective bonding technology

Jiwei Jiao; Axel Berthold; Michael J. Vellekoop; Patrick J. French

doi:10.1117/12.284488

5 September 1997 Influence of processes and selective bonding technology

Jiwei Jiao, Axel Berthold, Michael J. Vellekoop, Patrick J. French

Proceedings Volume 3223, Micromachining and Microfabrication Process Technology III; (1997) https://doi.org/10.1117/12.284488
Event: Micromachining and Microfabrication, 1997, Austin, TX, United States

Abstract

The influences of surface characteristics, including adsorptive states led by different chemical treatments and surface roughness, on direct bonding between dissimilar CVD materials were investigated. The bonding procedures were carried out at temperature lower than 400 degrees Celsius. In this temperature range, LPCVD poly-silicon, PECVD oxide, and LPCVD silicon-nitride showed highly process dependent bonding behaviors, i.e., bondable or not bondable to another material under certain experimental conditions. Based on these facts, a selective bonding conception for Si-based CVD material is proposed and applied to fabricate new fluid structures and devices.

Citation Download Citation

Jiwei Jiao, Axel Berthold, Michael J. Vellekoop, and Patrick J. French "Influence of processes and selective bonding technology", Proc. SPIE 3223, Micromachining and Microfabrication Process Technology III, (5 September 1997); https://doi.org/10.1117/12.284488

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