Performance of a new high-NA scanned-laser mask lithography system

Henry Chris Hamaker; Peter D. Buck

doi:10.1117/12.301205

12 February 1997 Performance of a new high-NA scanned-laser mask lithography system

Henry Chris Hamaker, Peter D. Buck

Proceedings Volume 3236, 17th Annual BACUS Symposium on Photomask Technology and Management; (1997) https://doi.org/10.1117/12.301205
Event: 17th Annual BACUS Photomask Technology and Management, 1997, Redwood City, CA, United States

Abstract

To meet the challenges of peak production of 0.25-micrometer design rule photomasks, a new generation of scanned-laser reticle writers has been developed. Based on the architecture of the ALTA 3000, the resolution and critical dimension (CD) control have been improved by integrating a new 33X, 0.8- NA reduction lens. The spot size of 0.27-micrometer FWHM represents a reduction by a factor of 0.6 relative to preceding scanned-laser products, thereby providing excellent CD linearity down to 0.5 micrometer. High throughput is maintained by reducing the number of averaging passes from eight to four. The sharper aerial image produced by the system limits the CD biasing which may be obtained using dose adjustment, so a dry etch process with zero etch bias must be used for optimal performance. Early characterization of the system indicates performance consistent with that required for 0.25 micrometer integrated circuits.

Citation Download Citation

Henry Chris Hamaker and Peter D. Buck "Performance of a new high-NA scanned-laser mask lithography system", Proc. SPIE 3236, 17th Annual BACUS Symposium on Photomask Technology and Management, (12 February 1997); https://doi.org/10.1117/12.301205

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