Potential of piezoelectric elements in the monitoring of composite manufacturing process

Xiaoming Wang; Claus Ehlers; Christian Kissinger; Manfred Neitzel; Lin Ye; Yiu-Wing Mai

doi:10.1117/12.293524

14 November 1997 Potential of piezoelectric elements in the monitoring of composite manufacturing process

Xiaoming Wang, Claus Ehlers, Christian Kissinger, Manfred Neitzel, Lin Ye, Yiu-Wing Mai

Proceedings Volume 3241, Smart Materials, Structures, and Integrated Systems; (1997) https://doi.org/10.1117/12.293524
Event: Far East and Pacific Rim Symposium on Smart Materials, Structures, and MEMS, 1997, Adelaide, Australia

Abstract

A piezoelectric wafer is here embedded in a glass fiber preform that is placed in a mould for resin transfer molding. The experiment displays that the resonant characteristics of a transfer function, in terms of the ratio between the electric voltage output from the piezoelectric wafer and the input to an electric circuit cascaded with the wafer, rely on resin injecting and curing process, and highlight the beginning/end of the resin injecting as well as the end of the exothermic reaction in composite manufacturing with the resin transfer molding. The relationships of the resonant response with resin flow and curing can then provide a basis of a prospective in-situ monitoring technique of the composite manufacturing. Further analysis reveals that the mechanical impedance, contributed by surroundings and associated with the resin flow, curing and exothermic induced temperature change, can be correlated with and even extracted from the transfer function amplitude at a frequency that is the same as the anti-resonant frequency of the piezoelectric wafer in air. It can further provide information about the flow front position and curing state of the resin.

Citation Download Citation

Xiaoming Wang, Claus Ehlers, Christian Kissinger, Manfred Neitzel, Lin Ye, and Yiu-Wing Mai "Potential of piezoelectric elements in the monitoring of composite manufacturing process", Proc. SPIE 3241, Smart Materials, Structures, and Integrated Systems, (14 November 1997); https://doi.org/10.1117/12.293524

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