Processing ceramics by laser radiation

Ernst-Wolfgang Kreutz; Juergen Jandeleit; Ruth Weichenhain; Manfred Sommer; Alexander Horn; A. Curdt

doi:10.1117/12.309492

3 June 1998 Processing ceramics by laser radiation

Ernst-Wolfgang Kreutz, Juergen Jandeleit, Ruth Weichenhain, Manfred Sommer, Alexander Horn, A. Curdt

Proceedings Volume 3274, Laser Applications in Microelectronic and Optoelectronic Manufacturing III; (1998) https://doi.org/10.1117/12.309492
Event: Optoelectronics and High-Power Lasers and Applications, 1998, San Jose, CA, United States

Abstract

Microprocessing and film deposition with laser radiation of short wavelength and pulse length are investigated to present their process capabilities for the manufacturing of surface structures and layers within precision ceramic (BaTiO₃, Si₃N₄, SiC) components. The microprocessing with fundamental (1(omega) ) and higher harmonic (2(omega) , 3(omega) ) Nd:YAG laser radiation (ns- and ps-pulses) is performed yielding structural dimensions below 20 micrometers during drilling and caving with the results related to the removal threshold fluence and the removal rate per pulse. The film deposition with excimer laser radiation ((lambda) _L equals 248 nm, (tau) _L equals 20 ns) achieves monolayer thin films of different properties according to the laser parameters and processing variables with the results related to deposit multilayer film systems. The properties of the structures and of the films are analyzed by profilometry, optical and electrical microscopy, as well as X-ray photoelectron spectroscopy. Examples are highlighted for various ceramics and discussed in view of applications of the structures and films generated.

Citation Download Citation

Ernst-Wolfgang Kreutz, Juergen Jandeleit, Ruth Weichenhain, Manfred Sommer, Alexander Horn, and A. Curdt "Processing ceramics by laser radiation", Proc. SPIE 3274, Laser Applications in Microelectronic and Optoelectronic Manufacturing III, (3 June 1998); https://doi.org/10.1117/12.309492

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