Paper
15 March 1998 Hybridization, assembling, and testing of miniaturized optoelectronic modules for sensors and microsystems
Harri K. Kopola, Pentti Karioja, Outi Rusanen, Heikki Lehto, Jorma Lammasniemi
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Abstract
This paper presents an overview of the research and development work on packaging and manufacturing different optoelectronic modules and microsystems for spectroscopic applications at VTT Electronics. Four different spectrometer concepts are analyzed: a multiwavelength detector module, an LED array spectrometer module, a PGP-spectrograph and an IR- spectrometer on silicon. The construction, main features, packaging concepts and performance are reviewed.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Harri K. Kopola, Pentti Karioja, Outi Rusanen, Heikki Lehto, and Jorma Lammasniemi "Hybridization, assembling, and testing of miniaturized optoelectronic modules for sensors and microsystems", Proc. SPIE 3276, Miniaturized Systems with Micro-Optics and Micromechanics III, (15 March 1998); https://doi.org/10.1117/12.302409
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CITATIONS
Cited by 3 scholarly publications.
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KEYWORDS
Sensors

Silicon

Spectroscopy

Optoelectronics

Packaging

Light emitting diodes

Electronics

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