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5 May 1998 High-density optical interconnect using polymer waveguides interfaced to a VCSEL array in molded plastic packaging
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Abstract
The technical approach and progress achieved under the Polymer Optical Interconnect Technology (POINT) program are described in this paper. The POINT program is a collaborative effort among GE, Honeywell, AMP, AlliedSignal, Columbia University, and University of California at San Diego (UCSD), sponsored by DARPA/ETO, to develop affordable optoelectronic packaging and interconnect technologies for board and backplane applications. Specifically, progress is reported on (a) development of a plastic VCSEL array packaging technology using batch and planar fabrication, (b) demonstration of high-density optical interconnects for board and backplane applications using polymer waveguides to a length of 50 cm at an I/O density of 250 channels per inch, (c) development of low-loss optical polymer waveguides with loss less than 0.1 dB/cm at 850 nm, and (d) development of passively alignment processes for efficient coupling between a VCSEL array and polymer waveguides. Significant progress has also been made under the POINT program at Columbia University, in applying CAD tools to simulate multi-mode-guided wave systems and, at UCSD, to assist mechanical and thermal design in optoelectronic packaging. Because of space limitations, these results will be described elsewhere in future publications.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yung-Sheng Liu, R. J. Wojnarowski, W. B. Hennessy, P. A. Piacente, John R. Rowlette Sr., Michael A. Kadar-Kallen, Jared D. Stack, Yue Liu, Andrzej Peczalski, and Ajay Nahata "High-density optical interconnect using polymer waveguides interfaced to a VCSEL array in molded plastic packaging", Proc. SPIE 3288, Optoelectronic Interconnects V, (5 May 1998); https://doi.org/10.1117/12.307590
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