High-density optical interconnect using polymer waveguides interfaced to a VCSEL array in molded plastic packaging

Yung-Sheng Liu; R. J. Wojnarowski; W. B. Hennessy; P. A. Piacente; John R. Rowlette Sr.; Michael A. Kadar-Kallen; Jared D. Stack; Yue Liu; Andrzej Peczalski; Ajay Nahata

doi:10.1117/12.307590

Translator Disclaimer

5 May 1998 High-density optical interconnect using polymer waveguides interfaced to a VCSEL array in molded plastic packaging

Yung-Sheng Liu, R. J. Wojnarowski, W. B. Hennessy, P. A. Piacente, John R. Rowlette Sr., Michael A. Kadar-Kallen, Jared D. Stack, Yue Liu, Andrzej Peczalski, Ajay Nahata

Author Affiliations +

Proceedings Volume 3288, Optoelectronic Interconnects V; (1998) https://doi.org/10.1117/12.307590
Event: Optoelectronics and High-Power Lasers and Applications, 1998, San Jose, CA, United States

Abstract

The technical approach and progress achieved under the Polymer Optical Interconnect Technology (POINT) program are described in this paper. The POINT program is a collaborative effort among GE, Honeywell, AMP, AlliedSignal, Columbia University, and University of California at San Diego (UCSD), sponsored by DARPA/ETO, to develop affordable optoelectronic packaging and interconnect technologies for board and backplane applications. Specifically, progress is reported on (a) development of a plastic VCSEL array packaging technology using batch and planar fabrication, (b) demonstration of high-density optical interconnects for board and backplane applications using polymer waveguides to a length of 50 cm at an I/O density of 250 channels per inch, (c) development of low-loss optical polymer waveguides with loss less than 0.1 dB/cm at 850 nm, and (d) development of passively alignment processes for efficient coupling between a VCSEL array and polymer waveguides. Significant progress has also been made under the POINT program at Columbia University, in applying CAD tools to simulate multi-mode-guided wave systems and, at UCSD, to assist mechanical and thermal design in optoelectronic packaging. Because of space limitations, these results will be described elsewhere in future publications.

Citation Download Citation

Yung-Sheng Liu, R. J. Wojnarowski, W. B. Hennessy, P. A. Piacente, John R. Rowlette Sr., Michael A. Kadar-Kallen, Jared D. Stack, Yue Liu, Andrzej Peczalski, and Ajay Nahata "High-density optical interconnect using polymer waveguides interfaced to a VCSEL array in molded plastic packaging", Proc. SPIE 3288, Optoelectronic Interconnects V, (5 May 1998); https://doi.org/10.1117/12.307590

ACCESS THE FULL ARTICLE