Electroless Cu plating of alumina treated with cw CO2 laser radiation

Beate Stolz; S. Geisler; George A. Shafeev; A. V. Simakin; Ernst-Wolfgang Kreutz; Reinhart Poprawe

doi:10.1117/12.320194

20 July 1998 Electroless Cu plating of alumina treated with cw CO₂ laser radiation

Beate Stolz, S. Geisler, George A. Shafeev, A. V. Simakin, Ernst-Wolfgang Kreutz, Reinhart Poprawe

Proceedings Volume 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS; (1998) https://doi.org/10.1117/12.320194
Event: 5th Annual International Symposium on Smart Structures and Materials, 1998, San Diego, CA, United States

Abstract

For the production of conductive structures in insulating ceramics UV excimer laser radiation is often used in two- step processes first to activate alumina, while the metal deposition is carried out subsequently from special solutions for electroless metal plating. An alternative process for obtaining conductive traces in alumina surface has been reported recently. However, the resulting conductivity is still far from the values required by fast progresses in packaging technology. In this paper the modification process is investigated with respect to the ability of the selectively laser-modified, alumina to promote electroless metal deposition. This is of basic interest because sources of CO₂ radiation are more stable and easier to handle in comparison to sources of excimer radiation. Moreover the described process can be considered as an alternative way of alumina activation. It is shown that alumina treated with cw CO₂ laser radiation under an ethanol layer takes on the ability to reduce Cu from its electroless plating bath which permits to significantly increase the conductivity of the laser- modified conductive tracers.

Citation Download Citation

Beate Stolz, S. Geisler, George A. Shafeev, A. V. Simakin, Ernst-Wolfgang Kreutz, and Reinhart Poprawe "Electroless Cu plating of alumina treated with cw CO₂ laser radiation", Proc. SPIE 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS, (20 July 1998); https://doi.org/10.1117/12.320194

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