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20 July 1998 Planarization of metallic parts for single- and multilevel (S)LIGA
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Abstract
The quality of surface finish and precise height of LIGA components produced by electroplating has been studied. Planarization is often required to meet specifications for both basic LIGA processing (single level) and extended LIGA processing (multi-level). The HI-MEMS Alliance has successfully developed such a planarization process.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chantal G. Khan Malek, Robert L. Wood, and Perry Genova "Planarization of metallic parts for single- and multilevel (S)LIGA", Proc. SPIE 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS, (20 July 1998); https://doi.org/10.1117/12.320158
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