Conductive bilevel resist system based on polysilphenylenesiloxane and polyaniline for nanometer lithography

Keiji Watanabe; Miwa Igarashi; Ei Yano

doi:10.1117/12.312379

29 June 1998 Conductive bilevel resist system based on polysilphenylenesiloxane and polyaniline for nanometer lithography

Keiji Watanabe, Miwa Igarashi, Ei Yano

Author Affiliations +

Proceedings Volume 3333, Advances in Resist Technology and Processing XV; (1998) https://doi.org/10.1117/12.312379
Event: 23rd Annual International Symposium on Microlithography, 1998, Santa Clara, CA, United States

Abstract

We propose a new bi-level resist system for nanometer lithography based on a polysilphenylenesiloxene resist over a conductive polianiline bottom layer for nanometer lithography. By introducing suitable polar functional groups, the polysilphenylenesiloxane negative electron-beam resist exhibits high sensitivity and high resolution with tetramethylammoniumhydroxide development. The sulfonated polyaniline in the conductive bottom layer can reduce resist charging and width shifts in the oxygen plasma etching. This conductive bi-level resist system can reduce pattern distortion from alignment errors and the proximity effect. The conductive resist system can also reduce the gate oxide leakage or breakdown caused by resist charging during the plasma etching process in MOS-LSI device fabrication. This system shows high pattern accuracy and process reliability, demonstrating its high potential for application in nanometer generation ULSI production.

Citation Download Citation

Keiji Watanabe, Miwa Igarashi, and Ei Yano "Conductive bilevel resist system based on polysilphenylenesiloxane and polyaniline for nanometer lithography", Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); https://doi.org/10.1117/12.312379

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