Paper
29 June 1998 New method of determination of the photoresist Dill parameters using reflectivity measurements
Patrick Schiavone, Stephane Bach
Author Affiliations +
Abstract
In this paper, we describe a new methodology for the determination of Dill parameters based on reflectivity measurements. In opposition to previous methods, samples are produced using the usual process steps. Silicon wafers and standard photoresist coating procedures are used. Moreover, reflectivity measurements can be performed on any reflectometer, a piece of equipment universally present in an industrial environment. A fitting procedure is performed on the reflectivity data in order to extract the ABC parameters. The delicate steps of the methods are described in the paper. Comparison with other exposure parameter extraction methods on I line resist shows good agreement. Dependence between exposure parameters and development parameter extraction is also discussed. It is shown that several empirical parameter sets can be equivalent, at least from the simulation point of view.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Patrick Schiavone and Stephane Bach "New method of determination of the photoresist Dill parameters using reflectivity measurements", Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); https://doi.org/10.1117/12.312378
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Cited by 1 scholarly publication.
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KEYWORDS
Reflectivity

Photoresist materials

Refractive index

Semiconducting wafers

Absorption

Picture Archiving and Communication System

Quartz

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