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26 August 1998 Compact modular MWIR FPA imager with exceptional sensitivity and resolution
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As high density staring focal plane array (FPA) detectors become available, imaging IR sensors must be constructed to display high performance images in compact packages. To make best use of engineering development efforts, the sensor packages must be designed to address multiple mission environments and to create displays for several detector types. Cincinnati Electronics has developed a 640 X 512 pixel InSb FPA and a 2-axis, micro-scanned, 256 X 256 array. These FPA alternatives have been incorporated into a new design sensor package utilizing a compact set of electronics and a miniature Stirling cryo-cooler. This camera design addresses a variety of missions ranging from an open frame OEM package to custom environmental housings. The detector interface can be electrically reconfigured to a variety of IR detectors, including medium or high-density arrays, as well as one or two dimensionally micro-scanned systems. This new packaging design demonstrates improvements over current systems in several performance areas: weight, package size, system sensitivity, system resolution, and fast Non-Uniformity Corrections. The device supports local or completely remote command operation. Rapid in-field reconfiguration is supported from an external connection. Digital and TV-standard analog display video are supported. Several examples are given of system tradeoffs in resolution and sensitivity to optimize system performance, with different FPA configurations for specific mission requirements.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John J. Forsthoefel, John G. Sanders, Mike Davis, and Fred Nicol "Compact modular MWIR FPA imager with exceptional sensitivity and resolution", Proc. SPIE 3377, Infrared Imaging Systems: Design, Analysis, Modeling, and Testing IX, (26 August 1998);

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