Paper
1 September 1998 Toward 150-nm defect detection capability
Author Affiliations +
Abstract
With the advance of photolithography technology into the super-resolution regime, reticle features are becoming denser and their dimensions are shrinking. This leads to much stricter design rules, which include a decrease in the dimensions of the critical defects needed to be detected. Orbot-Applied's new Improved Image Acquisition module has been developed as a means of meeting the rising demand in defect detection capability and integrated into RT-8000ES Die-to-Database reticle inspection system. The main purpose of this evaluation was to test the system's performance under difficult production conditions in its highest defect detection sensitivities.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yair Eran, Gad Greenberg, and Michael M. Har-Zvi "Toward 150-nm defect detection capability", Proc. SPIE 3412, Photomask and X-Ray Mask Technology V, (1 September 1998); https://doi.org/10.1117/12.328837
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KEYWORDS
Inspection

Reticles

Defect detection

Image acquisition

Calibration

Optical proximity correction

Molybdenum

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