Method Of Characterizing Wafer Steppers

Chris Van Peski

doi:10.1117/12.933680

15 October 1982 Method Of Characterizing Wafer Steppers

Chris Van Peski

Proceedings Volume 0342, Integrated Circuit Metrology I; (1982) https://doi.org/10.1117/12.933680
Event: 1982 Technical Symposium East, 1982, Arlington, United States

Abstract

Characterizing wafer exposure equipment is becoming more important with the increasing use of such equipment. The process of fully characterizing a wafer stepper involves making several hundred measurements to sub-micron tolerances. This paper describes a method of using the automatic reticle-to-wafer aligner to collect the large number of measurements necessary for system characterization. The analysis method involves exposing an array of alignment targets, and then measuring the X-Y coordinates of the targets using the automatic aligner. Using this method, it is possible to obtain precise X-Y coordinate data at the rate of thirty measurements per minute. The coordinate data is recorded on tape cassette and transferred to a desk-top computer for data reduction. The data is analyzed to determine the error contribution of each of a number of systematic error sources. Typical data for a number of systems is presented, and the data reduction method is described. One primary application for this method is to characterize level-dedicated production wafer exposure systems.

Citation Download Citation

Chris Van Peski "Method Of Characterizing Wafer Steppers", Proc. SPIE 0342, Integrated Circuit Metrology I, (15 October 1982); https://doi.org/10.1117/12.933680

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