Measuring particle deposition on witness surfaces using a silicon wafer scanner

Eugene N. Borson; Chris J. Schwindt

doi:10.1117/12.328487

27 October 1998 Measuring particle deposition on witness surfaces using a silicon wafer scanner

Eugene N. Borson, Chris J. Schwindt

Proceedings Volume 3427, Optical Systems Contamination and Degradation; (1998) https://doi.org/10.1117/12.328487
Event: SPIE's International Symposium on Optical Science, Engineering, and Instrumentation, 1998, San Diego, CA, United States

Abstract

Monitoring of cleanroom and spacecraft cleanliness during ground processing operations is essential in order to verify performance requirements for optical systems prior to launch. The objective is to replace manual particle counting with automated particle counting in order to reduce the processing time for the witness plates and to improve precision and accuracy of the measurements. A modified silicon wafer inspection instrument, using a HeNe laser light source, was used to count and size particles deposited on wafers exposed in the cleanrooms. The previous paper discussed measuring particles on silicon wafer witness plates during operations cleanrooms and discussed analytical methods for calculating percent area coverage. This paper describes the optical performance of the ESTEK instrument and test on the instrument.

Citation Download Citation

Eugene N. Borson and Chris J. Schwindt "Measuring particle deposition on witness surfaces using a silicon wafer scanner", Proc. SPIE 3427, Optical Systems Contamination and Degradation, (27 October 1998); https://doi.org/10.1117/12.328487

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