New generations of microelectronics and microsystem devices call for the utilization of a variety of new materials and the combination of materials with a widespread of their mechanical and thermal characteristics. Thermo-mechanical reliability issues as well as functional aims bear a big challenge to understand and to design mechanical behavior of devices and components. Laser interferometric and related measurement techniques with their capability to analyze mechanical properties of complex systems are essential tools accompanying the R&D process. At the IZM Berlin different kinds of laser methods have been used to analyze surface characteristics of components like surface profiles and roughness, deformation behavior due to thermo-mechanical load, and functional performance of systems. In particular, methods like interference microscopy, auto focus profilometry, speckle and holographic interferometry, speckle photography, interferometry on specular surfaces, Moire and microDAC have been applied. With regard to finite element based mechanical reliability studies of microtechnology devices deformation measurement methods are being introduced to verify simulation findings. Consequently, uncertainties in constitutive modeling of mechanical behavior or in material properties used can be significantly reduced. Measurement examples of experimental deformation analysis applied to advanced packaging like flip chip technology, chip scale packaging, new interconnect techniques and glob top encapsulation are demonstrated. Different kinds of laser optical measurements on printed circuit boards, micro coolers, actuator arrays, ball grid arrays illustrate the usefulness of mentioned methods for microelectronics and microsystem research and development. Integration of laser optical methods into future production lines is one of the project aims reported here.