Comparison of techniques for bonding VCSELs directly to ICs

Rui Pu; Eric M. Hayes; Carl W. Wilmsen; Kent D. Choquette; Hong Q. Hou; Kent M. Geib

doi:10.1117/12.308861

22 May 1998 Comparison of techniques for bonding VCSELs directly to ICs

Rui Pu, Eric M. Hayes, Carl W. Wilmsen, Kent D. Choquette, Hong Q. Hou, Kent M. Geib

Proceedings Volume 3490, Optics in Computing '98; (1998) https://doi.org/10.1117/12.308861
Event: Optics in Computing '98, 1998, Bruges, Belgium

Abstract

The fabrication technologies and bonding characteristics of three VCSEL bonding techniques are compared in order to determine the more reliable and robust.

Citation Download Citation

Rui Pu, Eric M. Hayes, Carl W. Wilmsen, Kent D. Choquette, Hong Q. Hou, and Kent M. Geib "Comparison of techniques for bonding VCSELs directly to ICs", Proc. SPIE 3490, Optics in Computing '98, (22 May 1998); https://doi.org/10.1117/12.308861

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