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22 May 1998Comparison of techniques for bonding VCSELs directly to ICs
The fabrication technologies and bonding characteristics of three VCSEL bonding techniques are compared in order to determine the more reliable and robust.
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Rui Pu, Eric M. Hayes, Carl W. Wilmsen, Kent D. Choquette, Hong Q. Hou, Kent M. Geib, "Comparison of techniques for bonding VCSELs directly to ICs," Proc. SPIE 3490, Optics in Computing '98, (22 May 1998); https://doi.org/10.1117/12.308861