Paper
31 August 1998 Fabrication of freestanding microstructures using UV lithography and double-electroplating technique
Chang-Wook Baek, Yong-Kweon Kim
Author Affiliations +
Proceedings Volume 3511, Micromachining and Microfabrication Process Technology IV; (1998) https://doi.org/10.1117/12.324305
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States
Abstract
A simple electroplating surface micromachining process for fabricating freestanding microstructures using UV lithography of thick photoresist and double electroplating has been developed. Compared with the conventional surface micromachining process, this process can be used to fabricate various shapes of freestanding 'out-of-plane' microstructure. In this process, two different materials electroplated continuously in a single mould are used as a sacrificial and a structural layer respectively. Fabrication of different shapes of 3D microstructures using controlled overplating on the patterned plate base electrode array has been reported, and this method was applied to form a 3D sacrificial layer. Shape of the sacrificial layer can be varied by changing width and space of the patterned plating base electrodes. After selective etching of the sacrificial layer we can obtain a released structure, the shape of which is automatically determined by that of sacrificial layer. Released gap and thickness of the structure are easily controlled by only changing electroplating time. Using this process, a simple microactuator that is able to move in the vertical direction and have inclined side-support beams is successfully fabricated. This technique can be applied to fabricate a novel type of surface micromachined actuating component.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chang-Wook Baek and Yong-Kweon Kim "Fabrication of freestanding microstructures using UV lithography and double-electroplating technique", Proc. SPIE 3511, Micromachining and Microfabrication Process Technology IV, (31 August 1998); https://doi.org/10.1117/12.324305
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KEYWORDS
Plating

Electrodes

Electroplating

Nickel

Gold

Lithography

Photoresist materials

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