High-accuracy micromachining of ceramics by frequency-tripled Nd:YAG lasers

Dirk Hellrung; Li-Ya Yeh; Frank Depiereux; Arnold Gillner; Reinhart Poprawe

doi:10.1117/12.352697

15 July 1999 High-accuracy micromachining of ceramics by frequency-tripled Nd:YAG lasers

Dirk Hellrung, Li-Ya Yeh, Frank Depiereux, Arnold Gillner, Reinhart Poprawe

Proceedings Volume 3618, Laser Applications in Microelectronic and Optoelectronic Manufacturing IV; (1999) https://doi.org/10.1117/12.352697
Event: Optoelectronics '99 - Integrated Optoelectronic Devices, 1999, San Jose, CA, United States

Abstract

Ceramics like Si₃N₄, Al₂O₃ and ZrO₂ and also diamonds can be hardly machined by conventional methods. Short pulse lasers, especially frequency-tripled, diode pumped Nd:YAG-lasers with a high beam quality offer the possibility to ablate these materials with high quality. With a spot size of about 10 micrometers , high fluences can be achieved, so that the materials are vaporized without or with only a small holes with diameters >= 5 micrometers and cutting of thin ceramic substrates. The edges are sharp and the face of the cut is very smooth. Furthermore it is possible to ablate three dimensional microstructures. Therefore the laser beam is scanned over the surface and the materials is ablated pulse beside optimized machining parameters the surface roughness can be reduced to R <EQ 0.1 micrometers . Due to the low ablation rate of around 0.05 (mu) g/pulse the ablation depth of a single slice can be controlled very precisely. Depending on the material and the machining parameters the depth is in the range of 1 to 10 micrometers .

Citation Download Citation

Dirk Hellrung, Li-Ya Yeh, Frank Depiereux, Arnold Gillner, and Reinhart Poprawe "High-accuracy micromachining of ceramics by frequency-tripled Nd:YAG lasers", Proc. SPIE 3618, Laser Applications in Microelectronic and Optoelectronic Manufacturing IV, (15 July 1999); https://doi.org/10.1117/12.352697

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