Paper
15 July 1999 Transient temperature measurement of amorphous silicon thin films during excimer laser annealing
Seung-Jae Moon, Ming-Hong Lee, Mutsuko Hatano, Kenkichi Suzuki, Constantine P. Grigoropoulos
Author Affiliations +
Abstract
The excimer laser annealing of amorphous silicon thin films has been investigated via optical diagnostics. Amorphous silicon films of 50 nm thickness are used in laser annealing. To obtain the transient temperature variation in the laser annealing process, the thermal emission and near- IR optical properties are measured. The front transmissivity and reflectivity are measured to obtain the emissivity at the 1.52 micrometers wavelength of the probe IRHeNe laser. Significant undercooling of the liquid silicon is observed during the cooling stage. The emissivity is almost constants during the melting period, but increases during the melting and solidification transformations.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Seung-Jae Moon, Ming-Hong Lee, Mutsuko Hatano, Kenkichi Suzuki, and Constantine P. Grigoropoulos "Transient temperature measurement of amorphous silicon thin films during excimer laser annealing", Proc. SPIE 3618, Laser Applications in Microelectronic and Optoelectronic Manufacturing IV, (15 July 1999); https://doi.org/10.1117/12.352692
Lens.org Logo
CITATIONS
Cited by 1 scholarly publication.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Reflectivity

Excimer lasers

Temperature metrology

Amorphous silicon

Annealing

Solids

Silicon

Back to Top