Paper
30 April 1999 Design of CMOS ICs for flip-chip integration with optoelectronic device arrays
Premanand Chandramani, Fouad E. Kiamilev, Ashok V. Krishnamoorthy, Richard G. Rozier, Jeremy T. Ekman, Ray Farbarik
Author Affiliations +
Abstract
Hybrid integration of optoelectronic devices, such as GaAs MQW modulators, to CMOS VLSI circuits provides the opportunity to design ICs that integrate millions of transistors and thousands of high-speed optical I/Os for high-performance computing and switching applications. One of the challenges in designing such large-scale ICs lies in the development of an efficient method for integrating existing VLSI circuit layouts with 2D arrays of optoelectronic devices. This paper presents several such methods and describes their application.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Premanand Chandramani, Fouad E. Kiamilev, Ashok V. Krishnamoorthy, Richard G. Rozier, Jeremy T. Ekman, and Ray Farbarik "Design of CMOS ICs for flip-chip integration with optoelectronic device arrays", Proc. SPIE 3631, Optoelectronic Integrated Circuits and Packaging III, (30 April 1999); https://doi.org/10.1117/12.348314
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KEYWORDS
Computer aided design

Very large scale integration

Optoelectronic devices

Transistors

Silicon

Optical components

Receivers

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