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28 April 1999 Active-to-passive element microassembly for photonic microsystems
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Proceedings Volume 3666, International Conference on Fiber Optics and Photonics: Selected Papers from Photonics India '98; (1999) https://doi.org/10.1117/12.347927
Event: International Conference on Fiber Optics and Photonics: Selected Papers from Photonics India '98, 1998, New Delhi, India
Abstract
New methods for integration of dissimilar components and optical inputs/outputs are expected to mass-produce photonic micro-systems at reduced levels of difficulty and therefore reduced cost. These methods involve monolithic and hybrid approaches, the latter at both wafer-to-wafer and chip-to- wafer levels. Broadly, these are called 'heterogeneous integration' and encompass technologies as diverse as wafer- fusion and DNA-assisted micro-assembly. This review summarizes the associated micro-assembly techniques and discusses their possible influence upon cost- and yield-benefits to industry.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sayan D. Mukherjee and Thor Bakke "Active-to-passive element microassembly for photonic microsystems", Proc. SPIE 3666, International Conference on Fiber Optics and Photonics: Selected Papers from Photonics India '98, (28 April 1999); https://doi.org/10.1117/12.347927
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