Fused silica for 157-nm transmittance

Charlene M. Smith; Lisa A. Moore

doi:10.1117/12.351163

25 June 1999 Fused silica for 157-nm transmittance

Charlene M. Smith, Lisa A. Moore

Proceedings Volume 3676, Emerging Lithographic Technologies III; (1999) https://doi.org/10.1117/12.351163
Event: Microlithography '99, 1999, Santa Clara, CA, United States

Abstract

The use of silica glass for the photomask material in 157-nm lithography tools is proposed. While fused silica enjoys widespread application for 248 and 193-nm optics, its use for 157-nm applications has been largely discounted, in part because of low transmittance at this wavelength. It is demonstrated here that silica glass can be made to have high transmittance at 157-nm. This is accomplished by minimizing the OH content of the glass. It is also noted that the thermal and mechanical properties of so-called dry silica are very close to higher OH silicas that are commonly used for lithography applications.

Citation Download Citation

Charlene M. Smith and Lisa A. Moore "Fused silica for 157-nm transmittance", Proc. SPIE 3676, Emerging Lithographic Technologies III, (25 June 1999); https://doi.org/10.1117/12.351163

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