Fused silica for 157-nm transmittance

Charlene M. Smith; Lisa A. Moore

doi:10.1117/12.351163

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25 June 1999 Fused silica for 157-nm transmittance

Charlene M. Smith, Lisa A. Moore

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Proceedings Volume 3676, Emerging Lithographic Technologies III; (1999) https://doi.org/10.1117/12.351163
Event: Microlithography '99, 1999, Santa Clara, CA, United States

Abstract

The use of silica glass for the photomask material in 157-nm lithography tools is proposed. While fused silica enjoys widespread application for 248 and 193-nm optics, its use for 157-nm applications has been largely discounted, in part because of low transmittance at this wavelength. It is demonstrated here that silica glass can be made to have high transmittance at 157-nm. This is accomplished by minimizing the OH content of the glass. It is also noted that the thermal and mechanical properties of so-called dry silica are very close to higher OH silicas that are commonly used for lithography applications.

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Charlene M. Smith and Lisa A. Moore "Fused silica for 157-nm transmittance", Proc. SPIE 3676, Emerging Lithographic Technologies III, (25 June 1999); https://doi.org/10.1117/12.351163

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