Translator Disclaimer
25 June 1999 Fused silica for 157-nm transmittance
Author Affiliations +
The use of silica glass for the photomask material in 157-nm lithography tools is proposed. While fused silica enjoys widespread application for 248 and 193-nm optics, its use for 157-nm applications has been largely discounted, in part because of low transmittance at this wavelength. It is demonstrated here that silica glass can be made to have high transmittance at 157-nm. This is accomplished by minimizing the OH content of the glass. It is also noted that the thermal and mechanical properties of so-called dry silica are very close to higher OH silicas that are commonly used for lithography applications.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Charlene M. Smith and Lisa A. Moore "Fused silica for 157-nm transmittance", Proc. SPIE 3676, Emerging Lithographic Technologies III, (25 June 1999);


Modified fused silica for 157-nm mask substrates
Proceedings of SPIE (February 03 2000)
Effects of halogen doping on structure of silica glass as...
Proceedings of SPIE (February 17 2003)
New silica glass for 157-nm lithography
Proceedings of SPIE (December 30 1999)
Dry and F doped fused silica for photomask substrate in...
Proceedings of SPIE (December 30 1999)
Properties of fused silica for 157-nm photomasks
Proceedings of SPIE (December 30 1999)

Back to Top