Self-supporting tantalum masks for deep x-ray lithography with synchrotron radiation

Sergey V. Litvin; Vasily G. Kanaev; Elena G. Larionova; Nina V. Glazunova; Ludmila P. Gromova; Vasily I. Yurchenko; Nikolai A. Timchenko; Lubov A. Mezentseva; Vladimir Nazmov; Valery F. Pindyurin

doi:10.1117/12.351115

25 June 1999 Self-supporting tantalum masks for deep x-ray lithography with synchrotron radiation

Sergey V. Litvin, Vasily G. Kanaev, Elena G. Larionova, Nina V. Glazunova, Ludmila P. Gromova, Vasily I. Yurchenko, Nikolai A. Timchenko, Lubov A. Mezentseva, Vladimir Nazmov, Valery F. Pindyurin

Author Affiliations +

Proceedings Volume 3676, Emerging Lithographic Technologies III; (1999) https://doi.org/10.1117/12.351115
Event: Microlithography '99, 1999, Santa Clara, CA, United States

Abstract

Development of the present-day technologies of manufacturing deep structures with submicron elements based on the deep x- ray lithography method with the usage of synchrotron radiation. Microelectronics used x-ray patterns with a 1.0 micrometers golden masking covering on different-type membranes become of unfit in this case both from the angle of contrast and from the standpoint of radiation and heat stability. X- ray patterns with the membrane on the base of tantalum 2 micrometers thick, that are high contrasting as to synchrotron radiation with wavelength of 0.2 to 1.0 nm, have been developed and manufactured. A set of pores 0.7 micrometers in diameter 1.5 micrometers apart in two directions was formed as the topological pattern.

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Sergey V. Litvin, Vasily G. Kanaev, Elena G. Larionova, Nina V. Glazunova, Ludmila P. Gromova, Vasily I. Yurchenko, Nikolai A. Timchenko, Lubov A. Mezentseva, Vladimir Nazmov, and Valery F. Pindyurin "Self-supporting tantalum masks for deep x-ray lithography with synchrotron radiation", Proc. SPIE 3676, Emerging Lithographic Technologies III, (25 June 1999); https://doi.org/10.1117/12.351115

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