Paper
11 June 1999 Optimization of 193-nm single-layer resists through statistical design
Allen H. Gabor, Ognian N. Dimov, Arturo N. Medina, Mark O. Neisser, Sydney G. Slater, Ruey H. Wang, Francis M. Houlihan, Raymond A. Cirelli, Gary Dabbagh, Richard S. Hutton, Ilya L. Rushkin, James R. Sweeney, Allen G. Timko, Omkaram Nalamasu, Elsa Reichmanis
Author Affiliations +
Abstract
Through a series of statistical design experiments we optimized the lithographic performance of a 193 nm single layer resists based on a norbornene-maleic anhydride matrix resin. Several interesting findings were found including that having the PEB temperature improved the performance of the resist. The polymer composition was found to strongly influence the lithographic performance of the resist. Variables that we examined included acrylate loading and blocking level. By optimizing the composition of the polymer, we have obtained resist with high etch resistance, square profiles and 0.130 micron dense line ultimate resolution in 0.5 micron thick films. The resist formulations are compatible with industry standard 0.262 N TMAH. During exposure the resists does not suffer from the outgassing of volatile species.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Allen H. Gabor, Ognian N. Dimov, Arturo N. Medina, Mark O. Neisser, Sydney G. Slater, Ruey H. Wang, Francis M. Houlihan, Raymond A. Cirelli, Gary Dabbagh, Richard S. Hutton, Ilya L. Rushkin, James R. Sweeney, Allen G. Timko, Omkaram Nalamasu, and Elsa Reichmanis "Optimization of 193-nm single-layer resists through statistical design", Proc. SPIE 3678, Advances in Resist Technology and Processing XVI, (11 June 1999); https://doi.org/10.1117/12.350205
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KEYWORDS
Polymers

Lithography

Binary data

Distributed interactive simulations

Etching

Photomasks

Resistance

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