Paper
11 June 1999 Recent progress in 193-nm antireflective coatings
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Abstract
This paper presents the chemistries and properties of organic, spin-on, bottom antireflective coatings (BARCs) that are designed for 193 nm lithography. All of the BARCs are thermosetting and use dye-attached/incorporated polymers. A first generation product, NEXT, will soon be commercialized. NEXT is built form i-line and deep-UV chemistries with the polymeric constituent being a substitute novolac. This product provide outstanding resolution of 0.16 micrometers L/S with several 193 nm photoresists. Second generation chemical platforms under study include acrylics, polyesters, and polyethers with the 193 nm absorbing chromophore being an aromatic function. The performance of selected BARCs from the four platforms is described, including: optical properties, 193 nm litho, plasma etch rates, Prolith modeling data, spin-bowl and waste line compatibility, and ambient stability.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
James D. Meador, Douglas J. Guerrero, Gu Xu, Xie Shao, Norman Dobson, James B. Claypool, and Kelly A. Nowak "Recent progress in 193-nm antireflective coatings", Proc. SPIE 3678, Advances in Resist Technology and Processing XVI, (11 June 1999); https://doi.org/10.1117/12.350269
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CITATIONS
Cited by 3 scholarly publications and 6 patents.
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KEYWORDS
Photoresist materials

Etching

Plasma etching

Polymers

Absorbance

Reflectivity

Plasma

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