Second-generation 193-nm bilayer resist

Patrick Foster; Thomas Steinhaeusler; John J. Biafore; Gregory D. Spaziano; Sydney G. Slater; Andrew J. Blakeney

doi:10.1117/12.350153

11 June 1999 Second-generation 193-nm bilayer resist

Patrick Foster, Thomas Steinhaeusler, John J. Biafore, Gregory D. Spaziano, Sydney G. Slater, Andrew J. Blakeney

Proceedings Volume 3678, Advances in Resist Technology and Processing XVI; (1999) https://doi.org/10.1117/12.350153
Event: Microlithography '99, 1999, Santa Clara, CA, United States

Abstract

We have recently developed a bilayer resist system based on a methacrylic silicon-containing imageable layer and a UV curable copolymer undercoat which has exhibited 0.13 micrometers resolution for dense features and 0.12 micrometers resolution for isolated features after substrate etch. In this paper, we will discuss recent advancements in the design of the second generation bilayer resist. In particular, we will discuss the development of two new thermally curable undercoats for use in both 193 nm and 248 nm applications. The optical properties of these new materials have been optimized to reduce reflectivity at the desired wavelength.

Citation Download Citation

Patrick Foster, Thomas Steinhaeusler, John J. Biafore, Gregory D. Spaziano, Sydney G. Slater, and Andrew J. Blakeney "Second-generation 193-nm bilayer resist", Proc. SPIE 3678, Advances in Resist Technology and Processing XVI, (11 June 1999); https://doi.org/10.1117/12.350153

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