Paper
23 July 1999 Low-power high-resolution 3D sonar imaging system
Steven R. Broadstone, Alice M. Chiang, John Impagliazzo
Author Affiliations +
Abstract
The need for multiple, cost-effective deployment of undersea acoustic mine-field reconnaissance and mine-hunting systems requires the development of light-weight, low-power, high- resolution sonars. These imaging sonars should be portable enough for use in a diver's hands or in a remote imaging sonar on an unmanned undersea vehicle in shallow waters. Under the support of the DARPA Sonoelectronics program, a system that can simultaneously focus many signals using multiple CCD/CMOS, programmable time-delay beamforming circuits connected to a sparsely-populated 2D acoustic array, is being developed. Using this approach, a real-time image could be formed to search for mine-like objects. To make a sparse array practical, the combination of low insertion loss and wide bandwidth performance is critical to realizing acceptable imaging performance with low illumination levels. In this system, a 20 cm diameter 2 MHz sparse array providing a 0.21 degree main beamwidth is proposed. Using this array, a real-time 2D cross-sectional scan of 128 X 128 pixels is achievable with a down-range and cross-range resolution of approximately 1 cm at a range of 3 m. In this paper, the signal-to-clutter ratios as a function of array bandwidth and sparse-array elements placement are presented. Furthermore, the performance of a CCD/CMOS subarray processor will be reported.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Steven R. Broadstone, Alice M. Chiang, and John Impagliazzo "Low-power high-resolution 3D sonar imaging system", Proc. SPIE 3711, Information Systems for Navy Divers and Autonomous Underwater Vehicles Operating in Very Shallow Water and Surf Zone Regions, (23 July 1999); https://doi.org/10.1117/12.354666
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CITATIONS
Cited by 5 scholarly publications.
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KEYWORDS
Phased arrays

Imaging systems

3D image processing

Transducers

Acoustics

Electronics

Signal attenuation

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