Evaluation method of 0.15- to 0.25-um advanced reticle inspection system

Andre Wang

doi:10.1117/12.360231

25 August 1999 Evaluation method of 0.15- to 0.25-μm advanced reticle inspection system

Andre Wang

Author Affiliations +

Proceedings Volume 3748, Photomask and X-Ray Mask Technology VI; (1999) https://doi.org/10.1117/12.360231
Event: Photomask and X-Ray Mask Technology VI, 1999, Yokohama, Japan

Abstract

Reticle inspection has been critically important for the sub- quarter micron generation IC industry. A good mask inspection tool has to provide enough sensitivity to capture all types of printable defects while avoids false alarms that generate production issues. It is important to develop a standard evaluation method to test the capability of different inspection machines. In this paper, we will discuss our standard evaluation method for new reticle inspection systems. A standard test pattern has been designed. Test results on a KLA 303 system will be displayed.

Citation Download Citation

Andre Wang "Evaluation method of 0.15- to 0.25-μm advanced reticle inspection system", Proc. SPIE 3748, Photomask and X-Ray Mask Technology VI, (25 August 1999); https://doi.org/10.1117/12.360231

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