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25 August 1999 Implementation issues for production OPC
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Proceedings Volume 3748, Photomask and X-Ray Mask Technology VI; (1999) https://doi.org/10.1117/12.360254
Event: Photomask and X-Ray Mask Technology VI, 1999, Yokohama, Japan
Abstract
As OPC becomes more widely used, there is great concern about additional time and costs that are incurred for both data manipulation and reticle manufacturing. In this paper, we discuss the optimal practices for the insertion of OPC into the standard IC pattern data generation, and find that the lowest risk point of insertion with the highest assurance of data integrity occurs when OPC is done as part of the physical verification process. In addition, we also examine the impact of OPC on reticle inspection practices, and find that, by following a few simple geometric guidelines, aggressive OPC can be implemented with no impact on reticle inspectability, significantly reducing the barriers to adoption.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Franklin M. Schellenberg and Pat LaCour "Implementation issues for production OPC", Proc. SPIE 3748, Photomask and X-Ray Mask Technology VI, (25 August 1999); https://doi.org/10.1117/12.360254
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