Manufacturability of a 0.18-um OPC technology

RenGuey Hsieh; Huitzu Lin; John C.H. Lin; Anthony Yen; Chue-San Yoo; Jia-Jing Wang

doi:10.1117/12.360209

25 August 1999 Manufacturability of a 0.18-μm OPC technology

RenGuey Hsieh, Huitzu Lin, John C.H. Lin, Anthony Yen, Chue-San Yoo, Jia-Jing Wang

Author Affiliations +

Proceedings Volume 3748, Photomask and X-Ray Mask Technology VI; (1999) https://doi.org/10.1117/12.360209
Event: Photomask and X-Ray Mask Technology VI, 1999, Yokohama, Japan

Abstract

A commercial OPC software is employed to add assisting features and hammerheads on the critical layers of VLSI chips; the resulting features on the masks and resist patterns on wafers have been studied. The 0.18 micrometer mask patterns with this OPC has shown approximately 0.3 micrometer wider focus latitude than that without OPC assistant features. The energy latitude is 6% larger for the one with OPC features. A microprocessor has been used as a vehicle to show the influence of adding OPC features in terms of product yield. Chips with OPC has about 6% to 8% higher yield than those without OPC under nominal exposure conditions. OPC turns out to be much more effective at extreme exposure conditions, e.g., at smaller CD regime very much less than 0.18 micrometer. The various defect types and sizes created in these OPC masks are also studied including defect printability on wafers.

Citation Download Citation

RenGuey Hsieh, Huitzu Lin, John C.H. Lin, Anthony Yen, Chue-San Yoo, and Jia-Jing Wang "Manufacturability of a 0.18-μm OPC technology", Proc. SPIE 3748, Photomask and X-Ray Mask Technology VI, (25 August 1999); https://doi.org/10.1117/12.360209

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