Paper
2 September 1999 16-k infrared micromirror arrays with large-beam deflection and .10-mm pixel size
Klaus Reimer, R. Engelke, Martin Witt, Bernd Wagner
Author Affiliations +
Proceedings Volume 3878, Miniaturized Systems with Micro-Optics and MEMS; (1999) https://doi.org/10.1117/12.361270
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
Abstract
Infrared micromirror arrays with large pixel size and large deflection angle have been fabricated and characterized. The paper presents the technology for the realization of micromirror arrays up to 1282 elements, which have both, a pixel size of 100 micrometer X 100 micrometer and a mirror tilting angle of plus or minus 15 degrees. This specification requires an approx. 13 micrometer gap for electrostatic actuation. A metal surface micromachining process has been developed using thick resist UV-lithography, multiple electroplating, a copper sacrificial layer and a CMP process step. Using nonplanar electrodes the driving voltage of electrostatic actuators can be reduced by factors. Using an electrical biasing concept the address voltage could be reduced further. A double layer metalization makes single mirror addressing within the array possible. Applicable switching times and the motion behavior will be discussed using measurement data of a vibrometer.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Klaus Reimer, R. Engelke, Martin Witt, and Bernd Wagner "16-k infrared micromirror arrays with large-beam deflection and .10-mm pixel size", Proc. SPIE 3878, Miniaturized Systems with Micro-Optics and MEMS, (2 September 1999); https://doi.org/10.1117/12.361270
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CITATIONS
Cited by 4 scholarly publications and 3 patents.
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KEYWORDS
Mirrors

Micromirrors

Electrodes

Copper

Electroplating

Nickel

Chemical mechanical planarization

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