Delamination study of chip-to-chip bonding for a LIGA-based safety and arming system

Gowrishankar Subramanian; Michael Deeds; Kevin R. Cochran; Raghu Raghavan; Peter A. Sandborn

doi:10.1117/12.359360

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18 August 1999 Delamination study of chip-to-chip bonding for a LIGA-based safety and arming system

Gowrishankar Subramanian, Michael Deeds, Kevin R. Cochran, Raghu Raghavan, Peter A. Sandborn

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Proceedings Volume 3880, MEMS Reliability for Critical and Space Applications; (1999) https://doi.org/10.1117/12.359360
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States

Abstract

The development of a miniature underwater weapon safety and arming system requires reliable chip-to-chip bonding of die that contain microelectromechanical actuators and sensors fabricated using a LIGA MEMS fabrication process. Chip-to- chip bonding is associated for several different bond materials (indium solder, thermoplastic paste, thermoplastic film and epoxy film), and bonding configurations (with an alloy 42 spacer, silicon to ceramic, and silicon to silicon). Metrology using acoustic micro imaging has been developed to determine the fraction of delamination of samples.

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Gowrishankar Subramanian, Michael Deeds, Kevin R. Cochran, Raghu Raghavan, and Peter A. Sandborn "Delamination study of chip-to-chip bonding for a LIGA-based safety and arming system", Proc. SPIE 3880, MEMS Reliability for Critical and Space Applications, (18 August 1999); https://doi.org/10.1117/12.359360

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