Paper
18 August 1999 MEMS reliability, process monitoring, and quality assurance
Howard R. Last, Bruce W. Dudley, Robert L. Wood
Author Affiliations +
Proceedings Volume 3880, MEMS Reliability for Critical and Space Applications; (1999) https://doi.org/10.1117/12.359363
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
Abstract
The reliability of a MEMS-based system depends on the producibility and environmental stability of the MEMS components as well as other components within the system. This article will focus on MEMS components in a sacrificial LIGA MEMS-based Safety & Arming (S&A) system. The process monitoring and quality assurance methods under development for LIGA MEMS S&A components are presented. These methods include techniques to study: (1) process bias, (2) material microstructure and mechanical properties, (3) mechanical response of spring-supported structures, and (4) actuator performance. Characterization of the as-produced components and materials serve as the starting point for future studies of reliability of LIGA MEMS components and systems. The utilization of several process monitoring and quality assurance methods in future reliability studies is discussed.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Howard R. Last, Bruce W. Dudley, and Robert L. Wood "MEMS reliability, process monitoring, and quality assurance", Proc. SPIE 3880, MEMS Reliability for Critical and Space Applications, (18 August 1999); https://doi.org/10.1117/12.359363
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Cited by 6 scholarly publications.
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KEYWORDS
Reliability

Microelectromechanical systems

Actuators

Nickel

Packaging

Weapons

Manufacturing

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