Spatially programmable temperature control and measurement for chemically amplified photoresist processing

Charles D. Schaper; Khalid A. El-Awady; Arthur E.B. Tay

doi:10.1117/12.361326

3 September 1999 Spatially programmable temperature control and measurement for chemically amplified photoresist processing

Charles D. Schaper, Khalid A. El-Awady, Arthur E.B. Tay

Author Affiliations +

Proceedings Volume 3882, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V; (1999) https://doi.org/10.1117/12.361326
Event: Microelectronic Manufacturing '99, 1999, Santa Clara, CA, United States

Abstract

Preliminary performance data is presented for a new thermal processing module. The system is directed towards conducting the temperature sensitive baking and chilling steps for chemically amplified photoresists. The module is comprised of 49 individual heating zones. The zones can be controlled independently with separate temperature sensing, actuation and feedback control mechanisms. A supervisory control strategy is applied to coordinate the individual zones. An in-situ chill plate is used to enable a temperature controlled cool-down phase without the need for substrate movement. Results are presented to demonstrate temperature control over the plate to within plus or minus 0.02 degrees Celsius. Wafer temperature is controlled to within plus or minus 0.05 degrees Celsius as measured at 5 sites. Photomask processing results are presented depicting steady-state control to within plus or minus 0.05 degrees Celsius as measured at 16 sites within one quadrant of the substrate. The advantages of the system are discussed including better temperature uniformity than conventional systems and the ability to conduct multiple experiments in a single run by biasing the setpoint across the substrate.

Citation Download Citation

Charles D. Schaper, Khalid A. El-Awady, and Arthur E.B. Tay "Spatially programmable temperature control and measurement for chemically amplified photoresist processing", Proc. SPIE 3882, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V, (3 September 1999); https://doi.org/10.1117/12.361326

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