Failure analysis of wafer-level reliability testing failure

Chong Khiam Oh; Soh Ping Neo; Jian Hua Bi; Zong Min Wu; Lian Choo Goh; Shailesh Redkar

doi:10.1117/12.361354

27 August 1999 Failure analysis of wafer-level reliability testing failure

Chong Khiam Oh, Soh Ping Neo, Jian Hua Bi, Zong Min Wu, Lian Choo Goh, Shailesh Redkar

Proceedings Volume 3884, In-Line Methods and Monitors for Process and Yield Improvement; (1999) https://doi.org/10.1117/12.361354
Event: Microelectronic Manufacturing '99, 1999, Santa Clara, CA, United States

Abstract

Wafer-level reliability (WLR) testing is an important tool that is used during the productization phase to investigate the reliability performance of devices and materials before full qualification cycle. The rapid nature of the WLR testing permits the process engineer to evaluate process variation and to obtain almost instantaneous feedback about its reliability impact. Fast reliability feedback is essential to help the process engineer build reliability into our product during the productization phase. Understand the root cause and failure mechanism after WLR testing, failure analysis plays a very important role. This paper describes the fundamental requirements for failure analysis equipment needed, the failure analysis and preparatory techniques used to locate the failure sites and cases study will be presented.

Citation Download Citation

Chong Khiam Oh, Soh Ping Neo, Jian Hua Bi, Zong Min Wu, Lian Choo Goh, and Shailesh Redkar "Failure analysis of wafer-level reliability testing failure", Proc. SPIE 3884, In-Line Methods and Monitors for Process and Yield Improvement, (27 August 1999); https://doi.org/10.1117/12.361354

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