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12 November 1999 Crossover photonic switching network with CMOS/SEED smart pixel device and 2D optical fiber bundle array
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Proceedings Volume 3896, Design, Fabrication, and Characterization of Photonic Devices; (1999) https://doi.org/10.1117/12.370372
Event: International Symposium on Photonics and Applications, 1999, Singapore, Singapore
Abstract
A 16 X 16 Crossover photonic switching network with hybrid integrated CMOS/SEED smart pixel device and 2D optical fiber bundle array I/O access device is reported in this paper. SEEd array devices ar used as light receivers and transmitters, while CMOS devices make efficient logical processing. 4 X 40 2D multilayer optical fiber bundle arrays are fabricated and are used as I/O access devices in the crossover photonic switching network. The center to center spacing between adjacent optical fibers in the same layer of the fiber array is 125micrometers , and the spacing between adjacent layers is 250micrometers . Displacing tolerance of the fiber bundle arrays is less than 4 micrometers and the angular tilt error is less than 0.03 degree. It has the feature of high density, high precision, array permutation and easy to couple with 2D CMOS/SEED smart pixel device.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Fengguang Luo, Mingcui Cao, Qiaoyan Hu, Anjun Wan, Jun Xu, Cong Deng, and Deming Liu "Crossover photonic switching network with CMOS/SEED smart pixel device and 2D optical fiber bundle array", Proc. SPIE 3896, Design, Fabrication, and Characterization of Photonic Devices, (12 November 1999); https://doi.org/10.1117/12.370372
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