Paper
7 June 2000 Selectively deposited copper on laser-treated polyimide using electroless plating
Gang Zhao, Harvey M. Phillips, HongYu Zheng, Siu Chung Tam, Wen Qing Liu, Gongling Wen, Zhiben Gong, Yee Loy Lam
Author Affiliations +
Abstract
Many reviews about the interconnection line fabrication by laser processing method were reported recently. UV laser process polyimide has been studied thoroughly during the past decade. In this report, we discussed the utilization of surface potential changing on polyimide film irradiated by excimer KrF laser and metallized the UV laser treated polyimide surface by electroless copper deposition. A new negatively charged polymer stabilized Pd solution was applied as catalyst in this experiment. We also produced pattern-wised fine line on KrF laser induced PI surface using this method.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gang Zhao, Harvey M. Phillips, HongYu Zheng, Siu Chung Tam, Wen Qing Liu, Gongling Wen, Zhiben Gong, and Yee Loy Lam "Selectively deposited copper on laser-treated polyimide using electroless plating", Proc. SPIE 3933, Laser Applications in Microelectronic and Optoelectronic Manufacturing V, (7 June 2000); https://doi.org/10.1117/12.387591
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Cited by 4 scholarly publications.
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KEYWORDS
Copper

Plating

Palladium

Excimer lasers

Particles

Ultraviolet radiation

Electroless plating

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