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7 November 1983Printing Sub-Micron Features Beyond The Normal Ootical Resolution Limit Using A Multi-Level Resist Technique
Sidewall erosion in plasma etching is employed to obtain sub-micron features derived from 1.5 to gum sized features which are printed in a standard scanning UV projector. The smallest features reliably obtained are 0.3μm wide.
A Marsh
"Printing Sub-Micron Features Beyond The Normal Ootical Resolution Limit Using A Multi-Level Resist Technique", Proc. SPIE 0394, Optical Microlithography II: Technology for the 1980s, (7 November 1983); https://doi.org/10.1117/12.935118
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A Marsh, "Printing Sub-Micron Features Beyond The Normal Ootical Resolution Limit Using A Multi-Level Resist Technique," Proc. SPIE 0394, Optical Microlithography II: Technology for the 1980s, (7 November 1983); https://doi.org/10.1117/12.935118