Design of scalable optical interconnection network using wavelength division multiplexing

Wencai Jing; Jindong Tian; Ge Zhou; Yimo Zhang; Wei Liu; Xun Zhang

doi:10.1117/12.384396

27 April 2000 Design of scalable optical interconnection network using wavelength division multiplexing

Wencai Jing, Jindong Tian, Ge Zhou, Yimo Zhang, Wei Liu, Xun Zhang

Proceedings Volume 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II; (2000) https://doi.org/10.1117/12.384396
Event: Symposium on Integrated Optoelectronics, 2000, San Jose, CA, United States

Abstract

This paper describes the two-layer scalable wavelength routing optical interconnection network being developed in Tianjin University. The top layer of the network is multi- wavelength bi-directional optical bus, which has high bandwidth and low latency. The optical bus is made up of passive components, no wavelength-tunable devices have been sued. As a result, the optical bus has low communication latency that is mainly decided by the optical fiber length. The sub-layer of the network is single-wavelength ring, which has low communication latency and high-scalability. In each ring, a wavelength routing node is used for data transmission between the ring and the optical bus. Each node computer is connected to the ring using an optical network interface card, which is based on peripheral component interconnect bus. The communication latency inside the ring is decreased using synchronous pipelining transmission technique. The scale of the ring is mainly limited by the efficient bandwidth required by each node computer. The number of rings is mainly decided by the optical power of the laser diodes and the sensitivity of the optical detectors. If Erbium doped fiber amplifier is used in the optical bus, the scale of the network can be further developed.

Citation Download Citation

Wencai Jing, Jindong Tian, Ge Zhou, Yimo Zhang, Wei Liu, and Xun Zhang "Design of scalable optical interconnection network using wavelength division multiplexing", Proc. SPIE 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II, (27 April 2000); https://doi.org/10.1117/12.384396

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available