Hybrid integration of polymer microlens with VCSEL using drop-on-demand technique

Yuzo Ishii; Shinji Koike; Yoshimitsu Arai; Yasushiro Ando

doi:10.1117/12.384419

27 April 2000 Hybrid integration of polymer microlens with VCSEL using drop-on-demand technique

Yuzo Ishii, Shinji Koike, Yoshimitsu Arai, Yasushiro Ando

Proceedings Volume 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II; (2000) https://doi.org/10.1117/12.384419
Event: Symposium on Integrated Optoelectronics, 2000, San Jose, CA, United States

Abstract

Polymer microlens fabrication techniques that enable easy integration with VCSELs are presented. We have developed a high-tolerance coupling structure with microlenses formed on both sides of the optical components for inter-chip optical interconnections, and have developed two types of drop-on- demand techniques for producing microlenses: an ink-jetting method and a dispensing method. Both methods use the surface tension of liquid UV-curable epoxy polymer. We have fabricated various microlenses that have a geometrical diameter from 20 micrometers to over 1 mm with F/1 to F/12 by controlling the volume and viscosity of the droplets and their wettability to the substrate. The measured uniformity in arrayed lenses was within +/- 1 percent in lens diameter and +/- 3 micrometers in pitch. Examples of how we have integrated microlenses with VCSELs are also presented. An ink-jetted microlens ona VCSEL coupled to a single-mode fiber enabled highly efficient coupling: 4 dB greater than without the microlens. A dispensed microlens on a VCSEL coupled to a multimode fiber increased the coupling efficiency by 20 dB compared to without a microlens. In the multimode case, large tolerances of +/- 2 mm in axial misalignment and +/- 10 micrometers in lateral misalignment were obtained for a coupling loss increase of 1 dB.

Citation Download Citation

Yuzo Ishii, Shinji Koike, Yoshimitsu Arai, and Yasushiro Ando "Hybrid integration of polymer microlens with VCSEL using drop-on-demand technique", Proc. SPIE 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II, (27 April 2000); https://doi.org/10.1117/12.384419

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