Imaging CSP: a die-size optical package for CMOS imagers and CCDs

Itzik Shweky; Avner P. Badihi

doi:10.1117/12.385458

15 May 2000 Imaging CSP: a die-size optical package for CMOS imagers and CCDs

Itzik Shweky, Avner P. Badihi

Proceedings Volume 3965, Sensors and Camera Systems for Scientific, Industrial, and Digital Photography Applications; (2000) https://doi.org/10.1117/12.385458
Event: Electronic Imaging, 2000, San Jose, CA, United States

Abstract

integrated Circuits (IC) and other sophisticated electronics consumer goods are commonplace in cameras of all kinds, sizes and price range. Today's state of the art digital imaging now makes it possible to achieve photographic quality at levels sufficient to support the growth of cameras applications such as video conferencing, video phones and Video Cellular phones, video Email and WEB site imaging. Additionally, to generate mass market appeal, digital imaging technology integrators and camera manufacturers had lowered the price of their products, increasing the pressure to lower the cost of the imaging engine, including both the die and the package. A newly introduced Die Size, Opto-Electronic Package offers a substantial reduction of both package costs and size (1,2). It provides the smallest and thinnest optical package for solid state light detectors and imaging devices such as CCD's and CMOS, and enables new applications which could not be realized with the current packaging technology. Colored imaging devices, in a variety of sizes have been packaged (figure 1). Optronic CSP's offer excellent dimensional accuracies with very tight mechanical tolerances.

Citation Download Citation

Itzik Shweky and Avner P. Badihi "Imaging CSP: a die-size optical package for CMOS imagers and CCDs", Proc. SPIE 3965, Sensors and Camera Systems for Scientific, Industrial, and Digital Photography Applications, (15 May 2000); https://doi.org/10.1117/12.385458

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