Mask fabrication by nanoimprint lithography using antisticking layers

Hubert Schulz; Frank Osenberg; J. Engemann; Hella-Christin Scheer

doi:10.1117/12.377114

3 February 2000 Mask fabrication by nanoimprint lithography using antisticking layers

Hubert Schulz, Frank Osenberg, J. Engemann, Hella-Christin Scheer

Proceedings Volume 3996, 16th European Conference on Mask Technology for Integrated Circuits and Microcomponents; (2000) https://doi.org/10.1117/12.377114
Event: 16th European Conference on Mask Technology for Integrated Circuits and Microcomponents, 1999, Munich, Germany

Abstract

We have studied anti-sticking layers for nanoimprint lithography using different types of polymers, thermoplastic and thermosetting ones. Typically thermosetting polymers have higher mask selectivity in a fluorocarbon dry etch process than the thermoplastic polymers, but replication into these materials is much more complicated. We observe a high tendency for the polymer to adhere to the stamp. To minimize the sticking problem a fluorocarbon coating of the stamp was tested. It was deposited in a radio frequency plasma reactor with C₄F₈ as a feed gas. The thickness of the coating was several nm. It was characterized by contact angle measurement, XPS and FTIR analysis. Such coatings could successfully reduce sticking effects during an imprint process.

Citation Download Citation

Hubert Schulz, Frank Osenberg, J. Engemann, and Hella-Christin Scheer "Mask fabrication by nanoimprint lithography using antisticking layers", Proc. SPIE 3996, 16th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (3 February 2000); https://doi.org/10.1117/12.377114

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