Resist technologies for ion projection lithography (IPL) stencil maskmaking

Mathias Irmscher; Joerg Butschke; Klaus Elian; Bernd Hoefflinger; Karl Kragler; Florian Letzkus; Joerg Ochsenhirt; Christian Reuter; Reinhard Springer

doi:10.1117/12.390072

21 July 2000 Resist technologies for ion projection lithography (IPL) stencil maskmaking

Mathias Irmscher, Joerg Butschke, Klaus Elian, Bernd Hoefflinger, Karl Kragler, Florian Letzkus, Joerg Ochsenhirt, Christian Reuter, Reinhard Springer

Author Affiliations +

Proceedings Volume 3997, Emerging Lithographic Technologies IV; (2000) https://doi.org/10.1117/12.390072
Event: Microlithography 2000, 2000, Santa Clara, CA, United States

Abstract

Corresponding to characteristics and manufacturing processes of IPL stencil masks, requirements of used resist technologies are determined. Two thin layer imaging (TLI) techniques, the single layer top surface imaging (TSI) and the bilayer CARL (chemical amplification of resist line) have been investigated and compared for stencil mask making. Especially the process design of CARL is discussed in detail. Additionally, a possible process integration of the carbon layer, that is deposited on the stencil mask and protects the membrane against damaging due to ion bombardment, is presented. Finally, results of silicon etching and complete manufactured stencil masks using the developed resist technologies are demonstrated.

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Mathias Irmscher, Joerg Butschke, Klaus Elian, Bernd Hoefflinger, Karl Kragler, Florian Letzkus, Joerg Ochsenhirt, Christian Reuter, and Reinhard Springer "Resist technologies for ion projection lithography (IPL) stencil maskmaking", Proc. SPIE 3997, Emerging Lithographic Technologies IV, (21 July 2000); https://doi.org/10.1117/12.390072

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