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10 April 2000 Moving from analysis to design: a MEMS CAD tool evolution
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Proceedings Volume 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS; (2000) https://doi.org/10.1117/12.382287
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, 2000, Paris, France
Abstract
The latest advances in MEMS technology have enabled the design of a new generation of electronic microsystems products. These systems may combine numerous analog/mixed signal microelectronics blocks and MEMS functions on a single chip or on two or more chips assembled within an integrated package. As designers have begun to use CAD tools to insert MEMS into these new products, additional requirements and constraints on the tools are emerging. As the MEMS designs move from prototypes to manufacturing production new CAD issues emerge.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Karim Liateni, Hee Jung Lee, Mary Ann Perez-Maher, and Jean Michel Karam "Moving from analysis to design: a MEMS CAD tool evolution", Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); https://doi.org/10.1117/12.382287
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