Paper
10 April 2000 New types of silicon torsion microspring and their characterization
Werner Brenner, Gh. Haddad, H. Rennhofer, M. Rennhofer, Aleksandar Vujanic, Gordana Popovic
Author Affiliations +
Proceedings Volume 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS; (2000) https://doi.org/10.1117/12.382305
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, 2000, Paris, France
Abstract
A number of methods for torque measurements in the macro domain exist, but only some of them can be scaled down to micro dimensions. This paper describes one method for measuring very small moments which is based on the measurement of torque by using silicon micro springs. Three different designs of torsion micro springs have been produced. The experimentally measured results show the possibility of torque measurement in the sub-(mu) Nm range.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Werner Brenner, Gh. Haddad, H. Rennhofer, M. Rennhofer, Aleksandar Vujanic, and Gordana Popovic "New types of silicon torsion microspring and their characterization", Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); https://doi.org/10.1117/12.382305
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Semiconducting wafers

Silicon

Etching

Mirrors

Microactuators

Finite element methods

Photomasks

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