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10 April 2000 Silicon optoelectronic integrated circuits for MOEMS
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Proceedings Volume 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS; (2000)
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, 2000, Paris, France
We realized different types of optoelectronic integrated circuits by integrating on the same silicon chip: photo detectors, linear or logic electronic circuits, waveguides, coupling elements. This paper present the design, modeling and experimental realization of these components, underlining the original approaches and results. Special structures of photo detectors were designed, in order to allow optical coupling with waveguides and monolithic integration with electronic and photonic circuits. Original models for these photo detectors were developed. The electronic circuits we realized, unlike those reported in literature, can operate at very low input currents. Also new materials and processes were studied and experimented in order to improve the component performance. Specific technologies for optoelectronic circuits, compatible with either CMOS or bipolar processes, were established by analyzing the relationships between the technological parameters and circuit characteristics. Also the matching with waveguides and micro mechanical structures technologies was analyzed and experimented, as the aim of our research activity was to realize different types of micro-electro- mechanical systems for sensor applications.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dana Cristea, Florea Craciunoiu, and M. F. Caldararu "Silicon optoelectronic integrated circuits for MOEMS", Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000);

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