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17 July 2000 Long linear HgCdTe arrays with superior temperature cycling reliability
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Abstract
To meet the demands for high temperature-cycling reliability of HgCdTe detectors, bonded to a Silicon 'Read-Out-Integrated- Circuit,' AIM has developed a Multi-Chip-Module approach for the infrared Focal-Plane-Array. Bonding of detector array and Si-chips on a sapphire substrate minimizes thermal stress and strain in the FPA, leading to cycle-to-failure of >= 1000. For maximum cycle estimation under varying strain, a correlation was established empirically.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Johann Ziegler, Marcus Finck, Rolf Krueger, Thomas Simon, and C. Joachim Wendler "Long linear HgCdTe arrays with superior temperature cycling reliability", Proc. SPIE 4028, Infrared Detectors and Focal Plane Arrays VI, (17 July 2000); https://doi.org/10.1117/12.391751
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